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? semiconductor components industries, llc, 2006 october, 2006 ? rev. 8 1 publication order number: mc1488/d mc1488 quad line eia?232d driver the mc1488 is a monolithic quad line driver designed to interface data terminal equipment with data communications equipment in conformance with the specifications of eia standard no. eia ? 232d. features ? current limited output 10 ma typical ? power ? off source impedance 300 minimum ? simple slew rate control with external capacitor ? flexible operating supply range ? compatible with all on semiconductor mdtl and mttl logic families ? pb ? free packages are available figure 1. simplified application mdtl logic output interconnecting cable interconnecting cable mdtl logic input line receiver mc1489 line driver mc1488 http://onsemi.com pdip ? 14 p suffix case 646 soic ? 14 d suffix case 751a 1 14 soeiaj ? 14 m suffix case 965 1 14 1 14 1 pin connections 2 output c input c2 input c1 output d input d2 v cc 14 input d1 v ee input a output a input b1 input b2 gnd output b 8 9 10 11 12 13 7 5 3 4 1 6 see general marking information in the device marking section on page 8 of this data sheet. device marking information see detailed ordering and shipping information in the package dimensions sect ion on page 8 of this data sheet. ordering information
mc1488 http://onsemi.com 2 figure 2. circuit schematic (1/4 of circuit shown) gnd 7 3.6 k pins 4, 9, 12 or 2 input pins 5, 10, 13 input 8.2 k v cc 14 7.0 k 70 6.2 k 70 output 300 10 k v ee 1 pins 6, 8, 11 or 3
mc1488 http://onsemi.com 3 maximum ratings (t a = + 25 c, unless otherwise noted.) rating symbol value unit power supply voltage v cc v ee + 15 ? 15 vdc input voltage range v ir ? 15 v ir 7.0 vdc output signal voltage v o 15 vdc power derating (package limitation, so ? 14 and plastic dual ? in ? line package) derate above t a = + 25 c p d 1/r ja 1000 6.7 mw mw/ c operating ambient temperature range t a 0 to + 75 c storage temperature range t stg ? 65 to + 175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. electrical characteristics (v cc = + 9.0 1% vdc, v ee = ? 9.0 1% vdc, t a = 0 to 75 c, unless otherwise noted.) characteristic symbol min typ max unit input current ? low logic state (v il = 0) i il ? 1.0 1.6 ma input current ? high logic state (v ih = 5.0 v) i ih ? ? 10 a output voltage ? high logic state (v il = 0.8 vdc, r l = 3.0 k , v cc = + 9.0 vdc, v ee = ? 9.0 vdc) (v il = 0.8 vdc, r l = 3.0 k , v cc = + 13.2 vdc, v ee = ? 13.2 vdc) v oh + 6.0 + 9.0 + 7.0 + 10.5 ? ? vdc output voltage ? low logic state (v ih = 1.9 vdc, r l = 3.0 k , v cc = + 9.0 vdc, v ee = ? 9.0 vdc) (v ih = 1.9 vdc, r l = 3.0 k , v cc = + 13.2 vdc, v ee = ? 13.2 vdc) v ol ? 6.0 ? 9.0 ? 7.0 ? 10.5 ? ? vdc positive output short ? circuit current, note 1 i os + + 6.0 + 10 + 12 ma negative output short ? circuit current, note 1 i os ? ? 6.0 ? 10 ? 12 ma output resistance (v cc = v ee = 0, ? v o ? = 2.0 v) r o 300 ? ? ohms positive supply current (r i = ) (v ih = 1.9 vdc, v cc = + 9.0 vdc) (v il = 0.8 vdc, v cc = + 9.0 vdc) (v ih = 1.9 vdc, v cc = + 12 vdc) (v il = 0.8 vdc, v cc = + 12 vdc) (v ih = 1.9 vdc, v cc = + 15 vdc) (v il = 0.8 vdc, v cc = + 15 vdc) i cc ? ? ? ? ? ? + 15 + 4.5 + 19 + 5.5 ? ? + 20 + 6.0 + 25 + 7.0 + 34 + 12 ma negative supply current (r l = ) (v ih = 1.9 vdc, v ee = ? 9.0 vdc) (v il = 0.8 vdc, v ee = ? 9.0 vdc) (v ih = 1.9 vdc, v ee = ? 12 vdc) (v il = 0.8 vdc, v ee = ? 12 vdc) (v ih = 1.9 vdc, v ee = ? 15 vdc) (v il = 0.8 vdc, v ee = ? 15 vdc) i ee ? ? ? ? ? ? ? 13 ? ? 18 ? ? ? ? 17 ? 500 ? 23 ? 500 ? 34 ? 2.5 ma a ma a ma ma power consumption (v cc = 9.0 vdc, v ee = ? 9.0 vdc) (v cc = 12 vdc, v ee = ? 12 vdc) p c ? ? ? ? 333 576 mw switching characteristics (v cc = + 9.0 1% vdc, v ee = ? 9.0 1% vdc, t a = + 25 c.) propagation delay time (z i = 3.0 k and 15 pf) t plh ? 275 350 ns fall time (z i = 3.0 k and 15 pf) t thl ? 45 75 ns propagation delay time (z i = 3.0 k and 15 pf) t phl ? 110 175 ns rise time (z i = 3.0 k and 15 pf) t tlh ? 55 100 ns 1. maximum package power dissipation may be exceeded if all outputs are shorted simultaneously.
mc1488 http://onsemi.com 4 characteristic definitions 10 13 9 4 12 5 1 2 14 9.0 v 5.0 v i ih i il ?9.0 v 7 1.9 v 7 v ol 9.0 v v oh 0.8 v v ol 3.0 k v oh 14 1 ?9.0 v 2 4 9 12 3 6 8 11 9 2 14 4 5 i os + 1 11 6 8 13 9 4 12 3 1 6.6 ma max 3 7 8 6 11 0.8 v 2 1.9 v 14 v ee v cc 7 10 12 i os v o 2.0 vdc i os ? t thl and t tlh measured 10% to 90% v o 15 pf 3.0 k 50% t phl t plh t tlh t thl e in 0 v 3.0 v 1.5 v e in v o i cc v il 2 v cc 1 14 7 12 4 9 i ee v ee 1.9 v v ih 0.8 v figure 3. input voltage figure 4. output current figure 5. output short ? circuit current figure 6. output resistance (power off) figure 7. power supply currents figure 8. switching response
mc1488 http://onsemi.com 5 typical characteristics (t a = +25 c, unless otherwise noted.) 2.0 1.8 1.6 1.4 1.2 0.4 0.2 0.6 0.8 1.0 ?9.0 ?3.0 0 3.0 6.0 ?12 9.0 12 ?6.0 0 v cc = v ee = 12 v v in , input voltage (v) v , output voltage (v) o v cc = v ee = 9.0 v v cc = v ee = 6.0 v figure 9. transfer characteristics versus power supply voltage v i v o 3.0 k i os ? 12 9.0 6.0 3.0 0 ?3.0 ?6.0 ?9.0 ?12 125 i os + 75 ?55 0 25 t, temperature ( c) i , short circuit output current (ma) sc figure 10. short circuit output current versus temperature v ee = 9.0 v 0.8 v v i 1.9 v v cc = 9.0 v 1000 1.0 100 10,000 1,000 c l , capacitance (pf) 10 10 100 1.0 slew rate (v/s) figure 11. output slew rate versus load capacitance v i v o c l 12 0 ?4.0 ?8.0 ?12 ?16 ?20 4.0 8.0 16 ?16 ?12 ?8.0 12 ?4.0 4.0 16 8.0 20 0 3.0 k load line v o , output voltage (v) i , output current (ma) o v o i os 1.9 v v cc = v ee = 9.0v 0.8 v v i + ? figure 12. output voltage and current ? limiting characteristics 25 4.0 6.0 8.0 10 12 14 ?55 125 75 2.0 0 16 t, temperature ( c) v , v , power supply voltage (v) cc ee 0 v ee 1 3.0 k 3.0 k 3.0 k 3.0 k 14 v cc 8 6 3 11 7 figure 13. maximum operating temperature versus power supply voltage
mc1488 http://onsemi.com 6 applications information the electronic industries association eia ? 232d specification details the requirements for the interface between data processing equipment and data communications equipment. this standard specifies not only the number and type of interface leads, but also the voltage levels to be used. the mc1488 quad driver and its companion circuit, the mc1489 quad receiver, provide a complete interface system between dtl or ttl logic levels and the eia ? 232d defined levels. the eia ? 232d requirements as applied to drivers are discussed herein. the required driver voltages are defined as between 5.0 and 15 v in magnitude and are positive for a logic ?0? and negative for a logic ?1.? these voltages are so defined when the drivers are terminat ed with a 3000 to 7000 resistor. the mc1488 meets this voltage requirement by converting a dtl/ttl logic level into eia ? 232d levels with one stage of inversion. the eia ? 232d specification further requires that during trans itions, the driver output slew rate must not exceed 30 v per microsecond. the inherent slew rate of the mc1488 is much too fast for this requirement. the current limited output of the device can be used to control this slew rate by connecting a capacitor to each driver output. the required capacitor can be easily determined by using the relationship c = i os x t/ v from which figure 14 is derived. accordingly, a 330 pf capacitor on each output will guarantee a worst case slew rate of 30 v per microsecond. 1000 10 100 1.0 10 333 pf 30 v/ s figure 14. slew rate versus capacitance for i sc = 10 ma c, capacitance (pf) 10,000 100 1,000 1.0 slew rate (v/s) the interface driver is al so required to withstand an accidental short to any other conductor in an interconnecting cable. the wo rst possible signal on any conductor would be another driver using a plus or minus 15 v, 500 ma source. the mc1488 is designed to indefinitely withstand such a short to all four outputs in a package as long as the power supply voltages are greater than 9.0 v (i.e., v cc 9.0 v; v ee ? 9.0 v). in some power supply designs, a loss of system power causes a low impedance on the power supply outputs. when this occurs, a low impedance to ground would exist at the power inputs to the mc1488 effectively shorting the 300 output resistors to ground. if all four outputs were then shorted to plus or minus 15 v, the power dissipation in these resistors would be excessive. therefore, if the system is designed to permit low impedances to ground at the power supplies of the drivers, a diode should be placed in each power supply lead to prevent overheating in this fault condition. these two diodes, as shown in fi gure 15, could be used to decouple all the driver packages in a system. (these same diodes will allow the mc1488 to withstand momentary shorts to the 25 v limits specified in the earlier standard eia ? 232b.) the addition of the diodes also permits the mc1488 to withstand faults with power supplies of less than the 9.0 v stated above. figure 15. power supply protection to meet power off fault conditions v cc 14 mc1488 v ee 7 mc1488 14 mc1488 14 7 1 171 the maximum short circuit current allowable under fault conditions is more than guaranteed by the previously mentioned 10 ma output current limiting. other applications the mc1488 is an extremely versatile line driver with a myriad of possible applications. several features of the drivers enhance this versatility: 1. output current limiting ? this enables the circuit designer to define the output voltage levels independent of power supplies and can be accomplished by diode clamping of the output pins. figure 16 shows the mc1488 used as a dtl to mos translator where the high level voltage output is clamped one diode above ground. the resistor divider shown is used to reduce the output voltage below the 300 mv above ground mos input level limit.
mc1488 http://onsemi.com 7 2. power supply range ? as can be seen from the schematic drawing of the driv ers, the positive and negative driving elements of the device are essentially independent and do not require matching power supplies. in fact, the positive supply can vary from a minimum 7.0 v (required for driving the negative pulldown section) to the maximum specified 15 v. the negative supply can vary from approximately ? 2.5 v to the minimum specified ? 15 v. the mc1488 will drive the output to within 2.0 v of the positive or negative supplies as long as the current output limits are not exceeded. the combination of th e current limiting and supply voltage features allow a wide combination of possible outputs within the same quad package. thus if only a portion of the four drivers are us ed for driving eia ? 232d lines, the remainder could be used for dtl to mos or even dtl to dtl translation. figure 17 shows one such combination. figure 16. mdtl/mttl ? to ? mos translator figure 17. logic translator applications mos output (with v ss = gnd) 10 k 1.0 k mdtl mttl input 1/4 mc1488 12 v ?12 v ?12 v mos output ?10 v to 0 v mdtl output ?0.7 v to +5.7 v mhtl output ?0.7 v to 10 v mrtl output ?0.7 v to +3.7 v ?12 v 10 k 1.0 k 5.0 v 8 1 11 6 3.0 v 3 mc1488 13 12 10 9 5 4 mdtl mmos input mdtl mhtl input 2 mdtl nand gate input mdtl input 12 v 14 7
mc1488 http://onsemi.com 8 ordering information device package operating temperature range shipping mc1488d soic ? 14 t a = 0 to +75 c 55 units/rail mc1488dg soic ? 14 (pb ? free) mc1488dr2 soic ? 14 2500/tape & reel mc1488dr2g soic ? 14 (pb ? free) mc1488p pdip ? 14 25 units/rail mc1488pg pdip ? 14 (pb ? free) MC1488M soeiaj ? 14 50 units/rail MC1488Mg soeiaj ? 14 (pb ? free) MC1488Mel soeiaj ? 14 2000/tape & reel MC1488Melg soeiaj ? 14 (pb ? free) marking diagrams a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g= pb ? free package pdip ? 14 p suffix case 646 soic ? 14 d suffix case 751a 1 14 mc1488p awlyywwg 1 14 mc1488g awlyww 1 14 mc1488dg awlyww soeiaj ? 14 m suffix case 965 mc1488 alywg
mc1488 http://onsemi.com 9 package dimensions soic ? 14 case 751a ? 03 issue h notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. ? a ? ? b ? g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t ? t ? f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 7.04 14x 0.58 14x 1.52 1.27 dimensions: millimeters 1 pitch soldering footprint* 7x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc1488 http://onsemi.com 10 package dimensions pdip ? 14 case 646 ? 06 issue p 17 14 8 b a dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l m ??? 10 ??? 10 n 0.015 0.039 0.38 1.01 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. f hg d k c seating plane n ? t ? 14 pl m 0.13 (0.005) l m j 0.290 0.310 7.37 7.87
mc1488 http://onsemi.com 11 package dimensions soeiaj ? 14 case 965 ? 01 issue a h e a 1 dim min max min max inches ??? 2.05 ??? 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.004 0.008 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 ??? 1.42 ??? 0.056 a 1 h e q 1 l e 10 0 10 l e q 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). 0.13 (0.005) m 0.10 (0.004) d z e 1 14 8 7 e a b view p c l detail p m a b c d e e 0.50 m z on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mc1488/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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